Resistors limit current flow and create voltage drops according to Ohm's Law (V = IR). They are used for biasing transistors, voltage division, current limiting for LEDs, pull-up/pull-down duties, and impedance matching. Their value is measured in Ohms (Ω), kΩ, or MΩ.
- Open circuit (burnt from overcurrent)
- Value drift — resistance increases over time from heat stress or age
- Cracked body (mechanical stress)
- SMD: lifted pads or tombstoning from thermal shock
- Cold solder joints causing intermittent faults
- Carbon film: noisy / intermittent if carbon layer damaged
- Through-hole: Cylindrical body, axial leads, colour-coded bands (4 or 5 bands)
- SMD: Small rectangular chip (0402–2512), numeric code (e.g., "103" = 10kΩ) or E96 code
- Wire-wound: Ceramic body, used in high-power circuits
- PCB marking: Prefix "R" (e.g., R12, R45)
- Symbol: Rectangle (IEC) or zigzag (ANSI/US)
- Mode: Ω (Resistance)
- Power must be OFF
- Capacitors must be discharged
- Lift one leg for accurate in-circuit reading
- Compare reading to colour code / silkscreen
- OL = open / burnt. 0Ω = shorted
Capacitors store and release electrical energy in an electric field between two conductive plates separated by a dielectric. They block DC while passing AC signals, filter power supply noise, couple AC stages, set timing in RC circuits, and provide bypass/decoupling functions. Value measured in Farads (F), µF, nF, pF.
- Electrolytic: bulging top vent, leaking electrolyte
- ESR increase — causes ripple on power rails
- Capacitance loss — value falls below rated (drying out)
- Tantalum: short-circuits under voltage spike or reverse polarity
- Ceramic: cracked body from flex or thermal shock
- Full short: 0Ω across terminals (dangerous)
- Electrolytic: Cylindrical, polarity marked (negative stripe/short lead)
- Ceramic: Small disc or SMD chip (e.g., "104" = 100nF)
- Tantalum: Teardrop/bead shape, marked with "+" for positive
- Film: Rectangular, often yellow/orange, high-voltage
- PCB marking: Prefix "C" (e.g., C4, C22)
- Mode: Capacitance (–|–) or Diode mode
- Power OFF, cap fully discharged before testing
- Check for short with Ω mode first
- Electrolytic: observe charge/discharge in Ω mode
- Compare reading to rated µF/nF value
- <80% rated = degraded; 0Ω = shorted
A P-N junction semiconductor that allows current to flow in one direction (forward bias) and blocks it in the other (reverse bias). Used for rectification (AC→DC), voltage clamping, protection against reverse polarity, signal demodulation, and as voltage references (Zener). Forward voltage drop: Si ≈ 0.6–0.7V, Schottky ≈ 0.2–0.4V, Ge ≈ 0.3V.
- Short circuit (low resistance both directions) — from over-voltage or surge
- Open circuit — from overcurrent burn-out
- Leakage — conducts slightly in reverse bias (aging)
- Zener: voltage reference drift
- LED: open circuit (no light), usually over-current failure
- Bridge rectifier: one or more diodes fail open or shorted
- Through-hole: Glass or plastic cylinder, cathode marked by silver/grey band
- SMD: Small SOD-323/SOD-123 package, cathode marked by a line
- LED: Clear/coloured lens, longer lead = anode (+)
- Bridge rectifier: Square component with 4 pins (AC, AC, +, −)
- PCB marking: Prefix "D" (e.g., D3, D14)
- Mode: Diode ⊢ (diode test)
- Power OFF, circuit discharged
- Forward: Red→Anode, Black→Cathode → 0.3–0.7V
- Reverse: Red→Cathode, Black→Anode → OL
- Short: both directions ~0V = shorted
- Open: both directions OL = open circuit
A BJT is a current-controlled semiconductor device. A small base current (IB) controls a much larger collector current (IC), with the ratio known as the current gain (hFE or β, typically 100–500). Used as amplifiers in analogue circuits and as electronic switches in digital logic, motor drivers, and relay drivers. NPN: common emitter switch; PNP: high-side switch.
- C-E short circuit — from thermal runaway or over-voltage
- B-E or B-C junction open — from ESD or overcurrent
- hFE (gain) degradation — junction damaged, still partially works
- Thermal runaway in power BJTs without heatsink
- Wrong pinout substitution — package pinout varies by part number
- Oscillation instability — in RF transistors
- TO-92: D-shaped plastic body, 3 pins (CBE or EBC — check datasheet)
- TO-220: Larger, with metal tab — power transistors
- SOT-23: SMD, 3-pin, very small
- Markings: Part number on body (e.g., 2N2222, BC547, 2SC945)
- PCB prefix: "Q" (e.g., Q1, Q3)
- Mode: Diode ⊢ for junction tests
- Mode: hFE socket for gain (if DMM has it)
- Test two P-N junctions: B-E and B-C
- NPN: Red to Base for both = 0.6–0.7V
- PNP: Black to Base for both = 0.6–0.7V
- C-E in both directions = OL (must not conduct)
A MOSFET is a voltage-controlled transistor. Gate voltage (VGS) controls the channel conductivity between Drain and Source. N-channel: positive VGS turns it ON. P-channel: negative VGS turns it ON. Key advantage over BJT: extremely high input impedance (gate), very fast switching, and low on-resistance (RDS(on)). Widely used in SMPS, H-bridges, and logic-level switching.
- Gate oxide breakdown — from ESD or over-voltage on gate (max ±20V typically)
- D-S short circuit — thermal runaway or avalanche breakdown
- Partial conduction (linear mode heating) — improper gate drive signal
- Latch-up in parasitic BJT structure
- Gate-source short — ESD punch-through of thin oxide
- RDS(on) increase at high temperature
- TO-220: Tab + 3 pins; part number on body (e.g., IRF540, IRFZ44N)
- D2PAK / TO-263: SMD power package
- SOT-23: Small SMD FET (logic-level)
- DFN/QFN: Low-profile SMD for high-efficiency converters
- PCB prefix: "Q" or "T" (e.g., Q2, T4)
- Mode: Diode ⊢
- Body diode: D to S (N-ch) = 0.4–0.7V
- Charge gate with Red probe to turn on channel
- D to S should then read near-0 (conducting)
- G-S: both directions OL (no junction)
- D-S in both directions initially OL before gate charge
An inductor stores energy in a magnetic field created by current flowing through its coil. It opposes changes in current (inertia effect). In DC circuits, it acts as a low-resistance path; at AC/high frequencies, it presents high impedance (XL = 2πfL). Used in switched-mode power supplies (buck/boost converters), EMI filters, RF tuning circuits, and chokes to block AC noise on DC lines. Measured in Henrys (H), mH, µH.
- Open winding — wire break from overcurrent or physical damage
- Shorted turns — insulation breakdown between turns, usually thermal
- Core saturation — inductance drops when current exceeds rated value
- Audible whine/buzz in SMPS inductors (magnetostriction)
- Ferrite core cracking — physical damage or vibration
- DCR increase from corroded windings
- Toroidal: Doughnut-shaped ferrite core with wire wound around it
- SMD power inductor: Shielded square package (e.g., 4×4mm), value printed on body
- Axial/radial: Coil on cylindrical core, colour-coded like resistors
- Ferrite bead: Small SMD package, used as EMI suppressor (acts as frequency-dependent resistor)
- PCB prefix: "L" (e.g., L1, L5)
- Mode: Continuity or Ω
- Healthy inductor: very low DCR (typically 0.01–5 Ω)
- OL = open winding (broken wire)
- Very high Ω = partial open or corroded
- Use LCR meter or DMM inductance mode for µH/mH value
- Shorted turns: hard to detect with DMM alone
Transformers transfer AC energy between two or more electrically isolated windings through a shared magnetic core. The voltage ratio equals the turns ratio: V1/V2 = N1/N2. Used for mains power adaptation, galvanic isolation, impedance matching in audio, gate drive isolation in SMPS, and current transformers for measurement. Only work with AC — will saturate on DC.
- Burnt smell / darkening from overload or short on secondary
- Open primary or secondary winding (continuity test fails)
- Shorted turns — excessive current draw, hot core
- Insulation breakdown between primary and secondary (safety hazard)
- Core saturation from DC offset or incorrect frequency
- Cracked bobbin / delaminated core
- Laminated EI core: Stacked silicon steel — large, mains-frequency transformers
- Toroidal: Doughnut shape — low leakage flux, hi-fi audio and clean PSUs
- Ferrite E/EE core: SMPS transformers — smaller, higher frequency
- Pot core / RM core: RF and precision inductance
- PCB prefix: "T" or "TR" (e.g., T1, TR2)
- Mode: Ω for winding continuity & DCR
- Mode: AC Volts for turns ratio check
- Primary DCR: 5–50 Ω typical
- Secondary DCR: 0.1–10 Ω typical
- Primary-to-Secondary Ω: must be OL (isolation)
- OL on any winding = open; low Ω winding-to-winding = insulation failure
An IC integrates thousands to billions of transistors, resistors, and other components onto a tiny silicon die. Types range from simple logic gates and op-amps to complex microprocessors and SoCs. All ICs require correct supply voltage(s), ground connections, and usually decoupling capacitors on their supply pins. The internal circuitry performs amplification, comparison, logic operations, signal conversion (ADC/DAC), communication, and control.
- ESD damage — internal junctions destroyed by static discharge
- Over-voltage on supply or I/O pins
- Latch-up — CMOS ICs enter parasitic SCR state (high current, excessive heat)
- Thermal damage from inadequate decoupling or cooling
- BGA solder ball cracking (thermal fatigue) on large packages
- Internal bond wire failure under vibration
- DIP: Rectangular dual-inline, through-hole (e.g., DIP-8, DIP-14)
- SOIC/SOP: SMD, gull-wing leads on 2 sides
- QFP/LQFP: SMD, leads on all 4 sides
- BGA: Ball Grid Array — solder balls underneath
- Pin 1 marking: Dot, notch, or chamfer on package
- PCB prefix: "U" or "IC" (e.g., U1, IC3)
- Mode: DC Volts — measure supply pins
- Mode: Diode ⊢ — check ESD protection diodes on I/O
- Each I/O pin to GND (Red+): expect 0.3–0.7V (ESD diode)
- VCC to GND: must match rated supply voltage
- Zero ohms supply-to-GND = shorted IC
- Thermal camera: shorted IC heats up rapidly
Voltage regulators maintain a stable, controlled output voltage from a varying input. Linear regulators (e.g., 7805, LM317, AMS1117) dissipate excess voltage as heat — simple but inefficient. Switching regulators (buck, boost, buck-boost) use inductors and capacitors with PWM switching for high efficiency (85–95%). LDO (Low Dropout) regulators work with very small input-output differences.
- Thermal shutdown — overheating from excessive current or inadequate heatsinking
- Output voltage wrong or drifting — internal reference damaged
- Output = Input voltage — internal pass transistor shorted (pass-through failure)
- 0V output — internal pass transistor open or input absent
- Switching regulator: MOSFET shorted causing high current on input rail
- Unstable output / oscillation — bad output capacitor ESR
- TO-220 3-pin: Classic 78xx/79xx series — Input, GND, Output
- SOT-223 / SOT-23-5: SMD LDOs (e.g., AMS1117, AP2112)
- Part number markings: 7805 (5V), 7812 (12V), LM317 (adj.), AMS1117-3.3
- Switching regulator ICs: Small SMD packages with enable, FB, SW pins
- PCB prefix: "U", "VR", or "IC" (e.g., U2, VR1)
- Mode: DC Volts
- Power ON: measure output vs GND
- Output = Input → shorted pass transistor
- Output = 0V → open pass transistor or no input
- Power OFF: Diode mode — output pin to GND
- Check input pin to confirm supply voltage reaching regulator
A relay uses an electromagnet (coil) energized by a control current to mechanically move an armature, switching one or more sets of contacts. This provides complete electrical isolation between the low-voltage control circuit and the switched load circuit. Types: SPDT, DPDT, latching, solid-state (SSR — uses a triac or MOSFET internally). Used for mains switching, automotive, industrial control, and protection circuits.
- Welded/fused contacts — from switching excessive current
- Open contacts — arcing has burned away contact material
- Coil open circuit — winding broken (no actuation)
- Contact resistance increase — oxidized or carbonized contacts
- Coil not releasing — magnetic remanence or mechanical jam
- SSR: internal TRIAC/MOSFET shorted (stays ON permanently)
- Through-hole: Rectangular cube with multiple pins, contact ratings printed on top
- Miniature PCB relay: 5-pin or 8-pin DIP-style (e.g., SRD-05VDC-SL-C)
- SSR: Semiconductor relay, often with 4 terminals in a larger housing
- Markings: Coil voltage (5VDC, 12VDC), contact rating (10A 250VAC)
- PCB prefix: "K" or "RLY" (e.g., K1, RLY2)
- Mode: Ω for coil and contact tests
- Coil resistance: typically 50–500 Ω (check label)
- NC contacts (de-energised): continuity/0 Ω
- NO contacts (de-energised): OL
- Energise coil with rated DC voltage — NC opens, NO closes
- Should hear click when energised/released
A quartz crystal exploits the piezoelectric effect — mechanical vibration at a precise resonant frequency when AC voltage is applied. Used with an oscillator amplifier circuit (internal to microcontrollers, or an external inverter gate) to produce a highly stable clock frequency. TCXO (temperature-compensated) and VCXO (voltage-controlled) variants offer higher stability. Crystal oscillator modules contain the crystal plus oscillator circuit and output a square wave directly.
- Crystal cracked or fractured — physical shock or ESD
- Frequency drift — aging, temperature, or contamination
- No oscillation — damaged crystal, wrong load capacitors, or MCU oscillator damaged
- Crystal sealed in metal can: verify by observing oscilloscope output, not DMM
- PCB trace damage — crystal traces are sensitive to stray capacitance
- Oscillator module: internal circuit failure (no output)
- HC-49/U: Through-hole, metal can, 2 pins, most common
- SMD Crystal: Small rectangular package (3225, 2016, 1612 sizes)
- XTAL Oscillator module: 4-pin DIP module (VCC, GND, Output, optional Enable)
- Frequency marked: e.g., "16.000" = 16MHz, "32.768" = 32.768kHz (RTC)
- PCB prefix: "Y", "X", "XTAL" (e.g., Y1, X2)
- DMM has limited use for crystal testing
- Ω mode: should read OL or very high resistance
- 0 Ω = physically cracked/shorted crystal
- Best test: oscilloscope on MCU crystal pins
- Oscillator module: DC V at output pin (should toggle between 0V and VCC)
- Replacement with known-good crystal is fastest diagnostic
Fuses sacrifice themselves — a wire element melts and opens the circuit when current exceeds rated value. PTC (Polyfuse) resettable fuses increase resistance dramatically when heated by overcurrent, limiting current until the fault is removed, then self-reset. TVS Diodes (Transient Voltage Suppressors) clamp voltage spikes to a safe level in nanoseconds, protecting sensitive ICs from ESD and inductive kickback. All are critical for reliable, safe circuit design.
- Fuse: opens (expected if doing its job — find root cause!)
- Fuse: nuisance blowing from an undersized fuse rating
- PTC: fails to reset (remains in high-resistance trip state)
- PTC: resistance too high permanently (aged component)
- TVS: shorted from an exceptionally large transient — protects the circuit by failing short
- TVS: clamping voltage drifts out of spec (aging)
- Glass tube fuse: Transparent cylinder — wire element visible (5×20mm or 3AG)
- Ceramic fuse: Opaque white/beige cylinder — must test with DMM
- SMD fuse: 1206/0603 chip, marked with current/voltage rating
- PTC/Polyfuse: Flat yellow/black SMD disc or through-hole disc
- TVS diode: Similar to Zener, marked DO-214AA/SMA or SOD-123
- PCB prefix: "F" (fuse), "D" (TVS), "PTC"
- Mode: Continuity 🔊 for fuses
- Fuse intact: beep / 0 Ω
- Fuse blown: OL
- PTC (cooled): <1 Ω. PTC (tripped/hot): kΩ range
- TVS: Diode mode — like a Zener diode response
- NEVER replace fuse without finding root cause!
| DMM Mode | Symbol | Power State | What You're Testing | PASS Reading | FAIL Reading |
|---|---|---|---|---|---|
| DC Voltage | V̄ / VDC | ON ⚠ | Supply rails, voltage regulator output, battery voltage, logic signal levels | Rated value ±5% | 0V or >spec |
| AC Voltage | V~ / VAC | ON ⚠ | Mains voltage, transformer secondaries, oscillator output amplitude | 230V mains / sec rated V | 0V = no output |
| Resistance | Ω | OFF | Resistor values, winding DCR, contact resistance, cable resistance | Within tolerance of rated value | OL=open; 0Ω=short |
| Continuity | 🔊 / →|← | OFF | PCB trace integrity, fuse condition, relay contacts, connector pins, cable continuity | Beep / <10Ω | OL = broken track/fuse |
| Diode Test | ⊢ / →| | OFF | Diodes, BJT junctions, MOSFET body diode, IC ESD diodes, LED polarity | Fwd: 0.3–0.7V; Rev: OL | 0V=short; OL both=open |
| Capacitance | –|– / F | OFF + discharged | Capacitor value verification, detecting dried-out or degraded capacitors | 80–120% of rated value | <70% = degraded |
| DC Current | A / mA | ON (series) ⚠ | Board quiescent current, LED current, motor current, charger current | Within spec idle/load range | Excessive = fault/short |
| hFE (Transistor) | hFE / β | OFF (DMM powers it) | BJT current gain (beta), NPN/PNP socket test | 100–500 for small signal BJTs | 0 or very low = damaged |